Thermal management has become increasingly important in modern electronics design as electronic components generate a significant amount of heat – CPUs, power diodes, power transistors are some examples, as is LED lighting.
The properties ofĀ 109-12Ā are ideal for most thermal management applications. This product has low viscosity, reducing air entrapment and allowing for minimal product application, which keeps thermal resistance low.Ā 109-12Ā is one-component low-stress epoxy, with low shrinkage during curing, and exceptional resistance to thermal-cycling. Similar products areĀ 108-50,Ā 111-17Ā andĀ 125-31C. Creative Materials’Ā 122-07(SP)Ā features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. The thermal cure cycle produces cross-linked, void free bonds. Another effective thermal management product isĀ 122-39(SD), a syringe-dispensable, 100% solids, thermally conductive, electrically insulating, one-component, epoxy adhesive, featuring excellent thermal stability, outstanding chemical resistance and excellent high temperature properties.
