Potting Compounds & Encapsulants

Creative Materials' standard and custom formulations of potting compounds and encapsulants electrically insulate electronic and electrical components while providing protection from negative environmental conditions of high or low temperatures and chemical exposure. Our potting compounds and encapsulants are used for military, automotive, microelectronic, aerospace and industrial applications in power supplies, tachometers, wiring harnesses, cable assemblies, ignition coils and other electronics.

Our potting compounds and encapsulants feature low shrinkage, excellent adhesion and bond strength. Their cure temperatures range from room temperature to a mild heat cure, and available custom packaging options include cartridges, bulk packaging and syringes. Several of Creative Materials' encapsulating materials are thermally conductive, resistant to thermal cycling and are useful for potting dissimilar materials.

Order Sample Technical

Potting Compounds

Product Part A
Product Part B
Mix Ratio by Weight
Working Life @ 21°C
Thermal Conductivity (W/mK)
F940A F940B 100:12 30 mins. 1.28 Black flame-out epoxy potting and encapsulating compound. Low viscosity, self de-aerating, thermally conductive. Room temperature cure.
F940A B-187 100:3 > 4 hours 1.28 Low viscosity with long pot life. Requires mild heat cure.
F947A F947B 100:12 30 mins. 1.28 Room temperature, improved heat resistance. Other properties similar to F940A/B.
F947A B-187 100:3 > 4 hours 1.28 Excellent heat resistance, extended pot life. Requires mild heat cure.
102-11A 102-11B 100:12 30 mins. 1.28 Crack resistant black flame-out epoxy potting compound. Room temperature cure, improved resistance to thermal cycling. Other properties similiar to F947A/B.
102-11A B-187 100:3 > 4 hours 1.28 Excellent resistance to thermal shock, longer pot life. Requires mild heat cure.
102-12A 102-12B 100:9 30 mins. 2.30 Thermal-cycle resistant, black, epoxy potting compound. Room-temperature cure, improved crack resistance. High thermal conductivity.
102-12A B-187 100:2.5 > 4 hours 2.30 Same as 102-12A/B, but extended pot life; better resistance to thermal cracking.
113-33A 113-33B 100:15 30 mins. 1.28 Crack resistant, black, flame-out, glob top epoxy. Non sag encapsulant.


Viscosity (cps) @ 25°C
Viscosity (cps) @ 50°C
Thermal Conductivity (W/mK)
108-50 100k to 160k 30k to 50k 1.83 Exceptional resistance to thermal cycling. Low stress, low shrink potting compound and adhesive. Ideal for stress-sensitive substrates.
109-12 500k 60k 5.65 Exceptional resistance to thermal cycling. Bonds dissimilar materials requiring Class “F+” service temperature rating. More thermally conductive version of 108-50.
116-20 20k - N/A Flexible UV-curable encapsulant

ISO 9001 ISO 14001 ROHS Reach